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datashee t product structure silicon monolithic integrated circuit this product has not designed protection against radioactive r ays 1/ 22 www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 2ch high side switch ics 2.4a current limit high side switch ics bd2068 fj -m bd2069 fj -m general description bd2068fj-m and BD2069FJ-M are d ual channel high si de switch ics with an over-current protection for of universal serial bus (usb) power supply line. its switch unit has two channels of n-channel power mosfet. over current detection circuit, thermal shutdown circuit, under-voltage lockout, and soft-start circuit are built in. features ? aec -q100 qualified (note 1) ? built-in dual low on-resistance n-channel mosfet(typ 80m ) ? control input logic ? active-high : bd2068 fj -m ? active- low : bd2069 fj -m ? soft-start circuit ? over current detection ? thermal shutdown ? under-voltage lockout ? open-drain error f lag output ? reverse current protection w hen power switch o ff ? flag output delay filter built in (note 1: grade3) applicatio ns car accessory key specifications ? input voltage range: 2.7v to 5.5v ? on -resistance: 8 0m (typ) ? continuous current load 1.0a ? current limit threshold: 1.5a (min), 3.0a (max) ? standby current: 0.01 a ( typ) ? output rise time: 0.8ms(typ) ? operating temperature range: - 40 c to +85c package w(typ) d(typ) h (max) typical application circuit lineup current limit threshold control input l ogic package orderable part number min typ max 1. 5a 2.4a 3.0a high sop- j8 reel of 25 00 bd2068 fj -mg e2 1. 5a 2.4a 3.0a low sop- j8 reel of 25 00 bd2069 fj -mg e2 sop- j8 4.90mm x 6.00mm x 1.65mm gnd in /en1 (en1) /oc1 out1 out2 /oc2 5v(typ) bd2068fj-m/69fj-m c l data /en2 (en2) c in data c l 3.3v 3.3v 10k to 100k 10k to 100k downloaded from: http:///
2/ 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 bloc k diagram gate logic1 ocd1 charge pump1 tsd1 uvlo charge pump2 ocd2 gate logic2 tsd2 /en1 en1 in /en2 en2 gnd /oc1 out1 out2 /oc2 delay delay pin configurations pin description pin no. symbol i / o pin function 1 gnd - ground. 2 in - power supply input. input terminal to the switch and power supply input terminal of th e internal circuit. 3, 4 en 1, /en1 en2, /en2 i enable input. en 1 , en2 : switch on at high level. (bd2068fj-m) /en1, /en2 : switch on at low level. (BD2069FJ-M) high level input > 2.0v, low level input < 0.8v. 5, 8 / oc 1, /oc2 o error flag output. low at over-current, thermal shutdown. open drain output. 6, 7 out1, out2 o switch output. bd2068 fj -m top view 1 2 8 7 gnd in /oc1 out1 3 en1 4 6 5 out2 /oc2 en2 bd2069 fj -m top view 1 2 8 7 gnd in /oc1 out1 3 /e n1 4 6 5 out2 /oc2 /e n2 downloaded from: http:///
3/ 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 absolute maximum ratings (ta=25c) parameter symbol rating unit supply voltage v in -0.3 to +6.0 v enable inpu t voltage v en , v /en -0.3 to +6.0 v /oc voltage v /oc -0.3 to +6.0 v /oc sink current i /oc 5 ma out voltage v out -0.3 to +6.0 v storage temperature tstg - 55 to + 150 c power dissipation pd 0.67 (note 1) w (note 1) mounted on 70mm x 70mm x 1.6mm glass-epoxy pcb. reduce 5.4mw/ o c above ta=25 o c caution: operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to co nsider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating co nditions parameter symbol rating unit min typ max operating voltage v in 2.7 - 5.5 v operating temperature t opr - 40 - + 85 c electrical characteristics bd2068 fj -m (unless otherwise specified v in = 5.0v, ta = 25c) pa ramet er symbol limit unit conditions min typ max operating current i dd - 130 180 a v en = 5 v , out=open standby current i stb - 0.01 1 a v en = 0 v , out=open en input voltage v en 2.0 - - v high input v en - - 0.8 v low i nput en input current i en -1.0 +0.01 +1.0 a v en = 0v or v en = 5v /oc output low voltage v /ocl - - 0.5 v i /oc = 1ma /oc output leak current i l /oc - 0.01 1 a v /oc = 5v /oc delay time t /oc 10 15 20 ms on-resistance r on - 80 125 m i out = 5 00ma switch leak current i l sw - - 1.0 a v en = 0v , v out = 0v reverse leak current i lrev - - 1.0 a v out = 5.5v, v in = 0v current limit threshold i th 1.5 2.4 3.0 a short circuit current i sc 1.1 1.5 2.1 a v out = 0v c l = 47f (rms) output rise time t on1 - 0.8 10 ms r l = 10 output turn-on time t on2 - 1.1 20 ms r l = 10 output fall time t off1 - 5 20 s r l = 10 output turn-o ff time t off2 - 10 40 s r l = 10 uvlo threshold v tuvh 2.1 2.3 2.5 v v in increasing v tuvl 2.0 2.2 2.4 v v in decreasing downloaded from: http:///
4/ 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 electrical characteristics - continued bd2069 fj -m (unless otherwise specified v in = 5.0v, ta = 25c) parameter symbol limit unit conditions min typ max operating current i dd - 13 0 180 a v /e n = 0 v , out=open standby current i stb - 0.01 1 a v /e n = 5v , out=open /en input voltage v /e n 2.0 - - v high input v /e n - - 0.8 v low i nput /en input current i /e n -1.0 +0.01 +1.0 a v /e n = 0v or v /e n = 5v /oc outpu t low voltage v /ocl - - 0.5 v i /oc = 1ma /oc output leak current i l /oc - 0.01 1 a v /oc = 5v /oc delay time t /oc 10 15 20 ms on-resistance r on - 80 125 m i out = 500ma switch leak current i l sw - - 1.0 a v /e n = 5v , v out = 0v reverse leak current i lrev - - 1.0 a v out = 5.5v, v in = 0v current limit threshold i th 1.5 2.4 3.0 a short circuit current i sc 1.1 1.5 2.1 a v out = 0v c l = 47f (rms) output rise time t on1 - 0.8 10 ms r l = 10 output turn-on time t on2 - 1.1 20 ms r l = 10 output fall time t off1 - 5 20 s r l = 10 output turn-o ff time t off2 - 10 40 s r l = 10 uvlo threshold v tuvh 2.1 2.3 2.5 v v in increasing v tuvl 2.0 2.2 2.4 v v in decreasing downloaded from: http:///
5/ 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 measurement circuit gnd in en1 en2 /oc1 out1 out2 /oc2 v in v en a 1f v en gnd in en1 en2 /oc1 out1 out2 /oc2 v in v en 1f v en r l c l r l c l a. operating current b. en, /en input voltage, output rise / fall time inrush current gnd in en1 en2 /oc1 out1 out2 /oc2 v in v en 1f v en i out i out v dd gnd in en1 en2 /oc1 out1 out2 /oc2 v in v en 1f v en i out 10k 10k i out c. on-resistance, over current detection d. /oc output low voltage figure 1. measurement circuit timing diagram t on2 v enh t on1 10% 90% v enl 90% 10% t off1 v out v en t off2 t on2 v /enl t on1 10% 90% v /enh 90% 10% t off1 v out v /e n t off2 figure 2. timing diagram(bd2068 fj -m) figure 3. timing diagram(bd2069 fj -m) downloaded from: http:///
6/ 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical performance curves (reference data) figure 4. op erating current vs supply voltage (en, /en enable) 0 20 40 60 80 100 120 140 160 180 2 3 4 5 6 supply voltage: v in (v) operating current: i dd (ua) ta=25c figure 6. standby current vs supply voltage (en, /en disable) 0 0.2 0.4 0.6 0.8 1 2 3 4 5 6 supply voltage: v in (v) standby current: i dd (ua) ta=25c figur e 5. operating current vs ambient temperature (en, /en enable) 0 20 40 60 80 100 120 140 160 180 -50 0 50 100 ambient temperature: t a ( ) operating current: i dd (ua) v in =5v figure 7. standby current vs ambient temperature (en, /en disable) 0 0.2 0.4 0.6 0.8 1 -50 0 50 100 ambient temperature: t a ( ) standby current: i dd (ua) v in =5v operating current: i dd ( a) operating current: i dd ( a) standby current: i stb ( a) stand by current: i stb ( a) ambient temperature : t a (c) ambient temperature : t a (c) supply voltage : v in (v) supply voltage : v in (v) downloaded from: http:///
7/ 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical performance curves - continued figure 1 1. /oc o ut put low voltage vs ambient temperature 0 20 40 60 80 100 -50 0 50 100 ambient temperature: t a ( ) /oc output voltage: v /oc (mv) v in =5v /oc o utput low voltage : v /oc l (mv) ambient temperature : t a (c) figure 1 0. /oc output low voltage vs supply voltage 0 20 40 60 80 100 2 3 4 5 6 supply voltage: v in (v) /oc output voltage: v /oc (mv) ta=25c /oc o utput low voltage : v /oc l (mv) supply voltage : v in (v) 0 0.5 1 1.5 2 2 3 4 5 6 supply voltage: v in (v) en input voltage: v en (v) ta=25c low to high high to low enable input voltage : v en , v / en (v) supply voltage : v in (v) figure 8. en, /en input voltage vs supply voltage (en1, en2, /en1, /en2) 0 0.5 1 1.5 2 -50 0 50 100 ambient temperature: t a ( ) en input voltage: v en (v) v in =5v high to low low to high enable input voltage: v en , v / en ( v) ambient temperature : t a (c) figur e 9. en, /en input voltage vs ambient temperature (en1, en2, /en1, /en2) downloaded from: http:///
8/ 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical performance curves - continued figure 1 2. on-resistance vs supply voltage 0 20 40 60 80 100 120 2 3 4 5 6 supply voltage: v in (v) on resistance: r on (m) ta=25c figure 1 3. on-resistance vs am bient temperature 0 20 40 60 80 100 120 -50 0 50 100 ambient temperature: t a ( ) on resistance: r on (m) v in =5v figur e 1 4. current limit threshold vs supply voltage 1.5 2 2.5 3 2 3 4 5 6 supply voltage: v in (v) current limt threshold: i th (a) ta=25c 1.5 2 2.5 3 -50 0 50 100 ambient temperature: t a ( ) current limit threshold: i th (a) v in =5v figure 1 5. current limit threshold vs ambient temperature on-resistance : r on (m ) on-resistance : r on (m ) current limit threshold : i th (a) current limit threshold : i th (a) ambient temperature : t a (c) ambient temperature : t a (c) supply voltage : v in (v) supply voltage : v in (v) downloaded from: http:///
9/ 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical performance curves - continued figur e 19. output rise time vs ambient temperature 0 0.2 0.4 0.6 0.8 1 -50 0 50 100 ambient temperature: t a ( ) rise time: t on1 (ms) v in =5v figure 18. output rise time vs supply voltage 0 0.2 0.4 0.6 0.8 1 2 3 4 5 6 supply voltage: v in (v) rise time: t on1 (ms) ta=25c figure 17. short circuit current vs ambient temperature 0 0.5 1 1.5 2 -50 0 50 100 ambient temperature: t a ( ) short circuit current:i sc (a) v in =5v figure 1 6. sh ort circuit current vs supply voltage 0 0.5 1 1.5 2 2 3 4 5 6 supply voltage: v in (v) short circuit currnt: i sc (a) ta=25c short circuit current : i sc (a) short circuit current : i sc (a) output rise time : t on1 ( ms ) output rise time : t on1 ( ms ) ambient temperature : t a (c) ambient temperature : t a (c) supply voltage : v in (v) supply voltage : v in (v) downloaded from: http:///
10 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical performance curves - c ontinued figure 2 0. ou tput turn on time vs supply voltage 0 0.2 0.4 0.6 0.8 1 2 3 4 5 6 supply voltage: v in (v) turn on time: t on2 (ms) ta=25c figure 2 1. output turn on time vs ambient temperature 0 0.2 0.4 0.6 0.8 1 -50 0 50 100 ambient temperature: t a ( ) turn on time: t on2 (ms) v in =5v figure 2 2. output fall time vs supply voltage 0 1 2 3 4 5 2 3 4 5 6 supply voltage: v in (v) fall time: t off1 (us) ta=25c figure 2 3. output fall time vs ambient temperature 0 1 2 3 4 5 -50 0 50 100 ambient temperature: t a ( ) fall time: t off1 (us) v in =5v output turn on time : t on 2 ( ms ) output turn on time : t on 2 ( ms ) output fall time : t o ff1 (s) output fall time : t o ff1 (s) supply voltage : v in (v) supply voltage : v in (v) ambient temperature : t a (c) ambient temperature : t a (c) downloaded from: http:///
11 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical performance curves - continued figur e 2 4. output turn off time vs supply voltage 0 2 4 6 8 10 2 3 4 5 6 supply voltage: v in (v) turn off time: t off2 (us) ta=25c figure 2 5. ou tput turn off time vs ambient temperature 0 2 4 6 8 10 -50 0 50 100 ambient temperature: t a turn off time: t off2 (us) v in =5v figure 2 6. /o c delay time vs supply voltage 0 5 10 15 20 2 3 4 5 6 supply voltage: v in (v) /oc delay time: t /oc (ms) ta=25c figure 27. /oc delay time vs ambient temperature 0 5 10 15 20 -50 0 50 100 ambient temperature: t a ( ) /oc delay time: t /oc (ms) v in =5v output turn o ff time : t o ff 2 (s) output turn off time : t o ff 2 (s) /oc delay time : t /oc (ms) /oc delay time : t /oc (ms) ambient temperature : t a ( c) ambient temperature : t a ( c) supply voltage : v in (v) supply voltage : v in (v) downloaded from: http:///
12 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical performance curves - continued 0 0.05 0.1 0.15 0.2 -50 0 50 100 ambient temperature: t a ( ) uvlo hysteresis: v hys (v) figure 29. uvlo hysteresis voltage vs ambient temperature figu re 28. uvlo threshold voltage vs ambient temperature 2 2.1 2.2 2.3 2.4 2.5 -50 0 50 100 ambient temperature: t a ( ) uvlo threshold: v uvlo (v) v uvloh v uvlol uvlo threshold : v uvloh, v uvlol (v) uvlo hysteresis voltage : v hys (v) ambient temperature : t a ( c) ambient temperature : t a ( c) downloaded from: http:///
13 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical wave forms BD2069FJ-M figure 3 2. inrush current c l =47f, 100f, 147f, 220f v / en 1v/div v out 1v/div v / oc 1v/div i in 0.5a/div time 200s/div v in =5v r l =5 c l =47f c l =220f c l =47f c l =220f figure 3 3. inrus h current v out1 1v/div v out2 1v/div v / oc 1 1v/div i out1 1.0a/div time 200s/div v in =5v c l =220f r l =5 figure 3 0. output rise characteristics v in =5v c l =100f r l =5 v / en 1v/div v out 1v/div v / oc 1v/div i in 0.5a/div time 200s/div figur e 3 1. output fall characteristics v / en 1v/div v out 1v/div v / oc 1v/div i in 0.5a/div time 1ms/div v in =5v c l =100f r l =5 downloaded from: http:///
14 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical wave forms - continued figure 3 5. ov er -current response 1 load connected at enable v out1 1v/div v /oc1 1v/div v out2 1v/div i out1 1.0a/div time 2ms/div v in =5v c l =47f figure 37. thermal shutdown response v /oc2 1v/div v out1 1v/div v / oc 1 1v/div i out1 0.5a/div time 100ms/div v in =5v c l =47f figur e 3 4. over-current response ramped load v out2 1v/div v out1 1v/div v / oc 1 1v/div i out1 0.5a/div time 5ms/div v in =5v c l =47f figure 3 6. over-c ur rent response enable to short circuit v / en 1v/div v out 1v/div v oc 1v/div i out1 0.5a/div time 2ms/div v in =5v c l =47f r l =1 downloaded from: http:///
15 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 typical application circuit on/off oc oc on/off gnd in /en1 (en1) /oc1 out1 out2 /oc2 10k~100k 5v(typ.) out in vbus d+ d- gnd data regulator usb controller bd2068 fj -m /6 9 fj -m c l data /en2 (en2) 10k~100k c in data c l application information when excessive current flows due to output short circuit or so, ring ing occurs by inductance between power source line and ic . this may cause bad effects on ic operations. in order to avoid this case, a bypass capacitor (c in ) should be connect ed acro ss in terminal and gnd terminal of i c. 1f or higher is recommended. pull up /oc output by a resistance value of 10k to 100k. set up values of c l which satisfies the application. this application circuit does not guarantee its operation. when using the circuit with changes to the external circu it constants, make sure to leave an adequate margin for e xternal components including ac/dc characteristics as well as dispersio n of the ic. functional description 1. switch operation in terminal and out terminal are connected to the drain and the source of switch mosfet respectively. the in terminal is also used as power source input to internal control circuit. when the switch is turned on from en(/en) control input, in and out terminals are connected by a 8 0m switch. in on status, the switch is bidirectional. therefore, when the poten tial of out terminal is higher than that of in terminal, curre n t flows from out to in terminal. on the other hand, when the switch is turned off, it is possible to prevent current from flowing reversely from out to in terminal since a parasitic d iode between the drain and the source of switch mosfet is not present. 2. thermal shutdown circuit (tsd) thermal shut down circuit have a dual thermal shutdown threshold. since thermal shutdown wo rks at a lower junction temperature when an ov er -current occurs, the switch turns off and outputs an error flag (/ oc). thermal shut down action has hysteresis. when the junctio n temperature goes down the switch automatically turns on and resets the error flag. unless the cause of increase of the chips temperature is rem oved or the output of power switch is turned off, this operation repeats. the thermal shut d own circuit works when the switch of either out1 or out2 i s on (en, /en signal is active). (typ) 10k to 100k 10k to 100k downloaded from: http:///
16 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 3. over-current detection (ocd) the over-current detection circuit limits current (i sc ) and outputs error flag (/oc) when current flowing in each switc h mosfet exceeds a specified value. the over-current detection circuit works when the switch is on (en, (/en) signal is active). there are three types of response against over-curren t: (1) when the switch is turned on while the output is in s hort circuit stat us , the switch goes into current limit status immediately. (2) when the output short-circuits or a high capacity load is connected while the switch is on, very large current flo ws until the over-current limit circuit reacts. when the current d etection and limit circuit operates, current limitation is carried out. (3) when the output current increases gradually, current limit ation would not operate unless the output current exceeds the over-current detection value. when it exceeds the detection v alue, current limitation is carried out. 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.3v(typ). if v in drops below 2.2v(typ) while the switch is still on, then uvlo shuts off the power switch. uvlo has a hysteresis of 100mv(typ). note: under-voltage lockout circuit operates when the switch of ei ther out1 or out2 is on (en,/en signal is active). 5. fault flag (/oc) output fault flag output is n-mos open drain output. during detection of over-current and/or thermal shutdown, the output level will turn low. over current detection has delay filter. this delay filter prevents current detection flags from being sent during instantaneous events such as inrush current at switch on or during hot plug . if fault flag output is unused, /oc pin should be connected to ground line or open. v en v out i out v /oc output short circuit thermal shutdown /oc delay time figure 38. over current detection, thermal shutdown timing (bd2068fj-m) v /en v out i out v /oc output short circuit thermal shutdown /oc delay time figure 39. over current detection, thermal shutdown timing (bd2069 fj -m) downloaded from: http:///
17 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 power dissipation (sop-j8) mounted on 70mm x 70mm x 1.6mm glass-epoxy pcb. figure 40. power dissipation curve (pd -ta curve) i/o equivalen ce circuit symbol pin no equivalen ce circuit en1(/en1) en2(/en2) 3, 4 /en1(en1) /en2(en2) /oc1 /oc2 5, 8 /oc1 /oc2 out1 out2 6, 7 out1 out2 0 100 200 300 400 500 600 0 25 50 75 100 125 150 ambient temperature: ta [ ] power dissipation: pd[mw] power dissipation : p d [ mw ] ambient temperature : ta [ c ] downloaded from: http:///
18 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and a ging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding thi s absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed un der the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one pow er supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors comple tely af ter each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a fe w. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
19 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 41 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is exceeded for a con tinued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peration. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. 16. over current protection circuit (ocp) this ic incorporates an integrated overcurrent protection circui t that is activated when the load is shorted. this protection circuit is effective in preventing damage due to sudden and unexpected incidents. however, the ic should not be used in applications characterized by continuous op eration or transitioning of the protection circuit. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
20 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 ordering information b d 2 0 6 8 f j - m g e 2 part number package fj: sop- j8 product rank m: for automotive packaging and forming specification g : halogen free e2: embossed tape and reel b d 2 0 6 9 f j - m g e 2 part number package fj: sop- j8 product rank m: for automotive packaging and forming specification g : halogen free e2: embossed tape and reel marking diagram part number part number marking bd2068fj-m d2068 BD2069FJ-M d2069 sop- j8 (top view) part number marking lot number 1pin mark downloaded from: http:///
21 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 physical dimension, tape and reel information package name sop-j8 downloaded from: http:///
22 / 22 bd2068fj-m bd2069 fj -m datasheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 tsz02201-0ggg0h300030-1-2 7.apr.2015 rev.001 revision history date revision changes 7.apr.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-paa-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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